IC package opening device
Package removal without causing physical or electrical damage! High selectivity etching.
We provide a device for failure analysis adapted for the packaging of advanced IC and other devices. Our unique new plasma technology, MIP (Microwave Induced Plasma), uses O2 (oxygen) plasma to remove the packaging. Additionally, the device can automatically perform a series of processes including etching, cleaning, and drying within a single unit. 【Features】 ■ Microwave Induced Plasma ■ O2 Plasma ■ Atmospheric Pressure Process ■ Fully Automatic Process *For more details, please refer to the PDF document or feel free to contact us.
- Company：ハイテック・システムズ
- Price：Other
